Nvidia Unveils First Blackwell Chip Wafer Made with TSMC in the US

In a landmark moment for American semiconductor manufacturing, Nvidia has unveiled its first Blackwell chip wafer produced in the United States, in collaboration with Taiwan Semiconductor Manufacturing Company (TSMC). The announcement was made by Nvidia CEO Jensen Huang during his visit to TSMC’s advanced fabrication facility in Phoenix, Arizona.

The Blackwell chip, designed to power next-generation artificial intelligence systems, marks a significant step in Nvidia’s strategy to localize production and strengthen the U.S. technology supply chain. The Phoenix facility is equipped to manufacture cutting-edge two-, three-, and four-nanometer chips, including the A16 series, which are critical for AI, telecommunications, and high-performance computing applications.

“This is a historic moment,” Huang said. “It’s the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC.” He emphasized that the move aligns with President Donald Trump’s broader vision to reindustrialize America and secure leadership in the AI era.

The unveiling comes amid surging global demand for AI chips, as companies race to develop technologies capable of matching or exceeding human intelligence. Nvidia’s decision to produce the Blackwell wafer domestically is seen as a strategic effort to reduce reliance on overseas manufacturing and bolster national resilience in critical tech infrastructure.

TSMC’s Arizona facility is expected to play a pivotal role in supporting the broader AI ecosystem, with Nvidia leading the charge in developing processors that will fuel data-driven innovation across industries.

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